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DS34S132GN+

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DS34S132GN+

Packaging : Tray

Power (Watts) : -

Product Category : Telecom Interface ICs

Interface : TDMoP

Supplier Device Package : 676-TEPBGA (27x27)

Package / Case : 676-BGA

Part Status : Active

Number of Circuits : 1

Operating Temperature : -40°C ~ 85°C

Current - Supply : -

Series : -

Mounting Type : Surface Mount

Function : TDM-over-Packet (TDMoP)

Voltage - Supply : 1.8V, 3.3V

Manufacturer : Maxim Integrated

Description : IC TDM OVER PACKET 676-BGA

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The DS34S132GN+,from Maxim Integrated,is Telecom Interface ICs.what we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please contact us through the “online chat” or send a quote to us!

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